Eurovac deposition system

Responsible: Taras Golod,

New procedure when using SiO2 sputter target! 2011-03-16, Stefan Rosén, A. Liljeborg

The sputtering of SiO2 is causing subsequent sputtering of gold to generate flakes falling of the surfaces. The gold will not stick to surfaces covered with SiO2. To remedy this a sticking layer of titanium must be deposited after each SiO2 sputtering.
  1. Always sign in the Logbook.
  2. Gold does not stick on the SiO2.
  3. Before Gold deposition check the logbook and if necessary start with about 5 nm Ti deposition.

End of new procedure when using SiO2 sputter target.

Short description how to use sputter guns

Manual for thickness monitor (pdf)

New tool factor = old tool factor × measured film thickness

desired film thickness

Short user guide

Overview
Overview image of the system

Loading Sample:

  1. Put samples on the sample holder and make sure they are secure.
  2. Check if small turbo pump is running.
        If NO go to step 5
  3. Close the valve to the small turbo pump.
  4. Turn off the small turbo pump.
  5. Open the two valves to let nitrogen into the load-lock
  6. When load-lock opens, close the nitrogen valves.
  7. Attach the Sample holder to the transfer rod (Using fresh gloves and the turbo-pump safety plate), check that all 3 clamps are ok.
  8. Close load-lock
  9. Open the valve for the small turbo pump.
  10. Start the small turbo pump while gently holding load lock tight
  11. When turbo controller says "normal operation" the pump down is finished (check the pressure in load-lock. Should reach its minimum value, about 2×10-2)
  12. Open valve into main chamber
  13. Transfer sample from rod to internal holder (make sure internal holder is at 270°, and not locked)
  14. Remove the transfer rod
  15. Close main chamber valve

Depositing

There are silver colored labels with numbers from 1-6, placed on the various handles, levers, etc. on the system. These labels are indicated in brackets in the following description.

Select what metal to deposit, selected by turning long red handle with holes at the front. There is a list of which metals are at which positions on the wall. There are 12 turns between adjacent positions for each metal.

  1. Check logbook: if SiO2 has been sputtered always start deposit 5 nm Ti.
  2. Make sure that correct material (crucible) and deposition program are selected
  3. Turn the sample to 0°.
  4. Close sample shutter
  5. Open Target shutter [4]
  6. Turn on main e-gun power supply (check that cooling water is on) [1]
  7. Turn on sweep control [2]
  8. Turn on gun current [3]
  9. Slowly increase the filament current (steps of 0.10 with 20 sec wait in between) [5]
  10. After reaching 1.0 start increase continuously (but still slowly) until you get a stable rate.
  11. Open sample shutter and at the same time press "zero" on the thickness monitor [6]
  12. Close window shutter to avoid depositing material on view port
  13. Change angle if desired
  14. When desired thickness is achieved, close the Sample shutter
  15. Turn down current
  16. Turn off gun current
  17. Turn off sweep control
  18. Turn off main e-gun power supply (keep the cooling water on)

Unloading

  1. Open window shutter
  2. Close target shutter
  3. Open sample shutter
  4. Rotate sample holder to 270°
  5. Open main chamber valve
  6. Insert transfer rod
  7. Remove sample holder
  8. Close main chamber valve
  9. Close pump valve
  10. Turn off pump
  11. Open nitrogen valves
  12. When load lock opens, close nitrogen valves
  13. Take out sample holder (Using fresh gloves)
  14. Close load lock

    If you will use system again within a few minutes you can leave it like this.
    Otherwise go on:

  15. Open pump valve
  16. Start Pump
  17. Open pump valve all the way

    If you or someone will use system later that day you can leave it like this.

    If no one is going to use the system (as far as you know) continue below.

  18. When pump controller says "Normal operation" close pump valve
  19. Turn of pump

meters_txt.jpg
Upper part of electronics rack showing:
Thickness monitor Pressure meter for airlock and chamber
Turbo pump control for main chamber Turbo pump control for airlock

evap3_txt.jpg
Main chamber with metal selector.

water_txt.jpg
Cooling water valves.

rack_txt.jpg
Lower part of rack, showing sweeper and e--gun mains switch.

Close-up
Close-up view showing the different valves and shutters

evap2_txt.jpg
View from different angle of central parts of the deposition system.


Through viewport, empty sample holder.


Through viewport, sample rotated downwards, sputtering active.

Cesar 600 W RF power generator manual (pdf) for sputtering target. Limited access.
Cesar auto-matching unit manual (pdf) for sputtering target. Limited access.
Short description how to use sputter guns

Service, cleaning, 2005-10-14
E-gun, melted leads to filament, 2004-05-28
E-gun, arcing, 2004-02-11

Movie of loading (MPEG4, .mp4)
Courtesy of Daniel Öijerholm-Ström, taken with cell-phone camera.

Exchange of crucible, some images inside


Anders Liljeborg Nano-Fab-Lab, KTH.