Eurovac deposition system

Repsonsible: Vladimir Krasnov, Stefan Rosén

New procedure when using SiO₂ sputter target! 2011-03-16, Stefan Rosén, A. Liljeborg

1. Always sign in the Logbook.
2. Gold does not stick on the SiO2.
3. Before Gold deposition check the logbook and if necessary start with about 5 nm Ti deposition.

End of new procedure when using SiO₂ sputter target.

Manual for thickness monitor (pdf)

New tool factor =	old tool factor × measured film thickness
	desired film thickness

Short user guide

Overview image of the system

Loading Sample:

1. Put samples on the sample holder and make sure they are secure.
2. Check if small turbo pump is running.
       If NO go to step 5
3. Close the valve to the small turbo pump.
4. Turn off the small turbo pump.
5. Open the two valves to let nitrogen into the load-lock
6. When load-lock opens, close the nitrogen valves.
7. Attach the Sample holder to the transfer rod (Using fresh gloves and the turbo-pump safety plate), check that all 3 clamps are ok.
8. Close load-lock
9. Open the valve for the small turbo pump.
10. Start the small turbo pump while gently holding load lock tight
11. When turbo controller says "normal operation" the pump down is finished (check the pressure in load-lock. Should reach its minimum value, about 2×10^-2)
12. Open valve into main chamber
13. Transfer sample from rod to internal holder (make sure internal holder is at 270°, and not locked)
14. Remove the transfer rod
15. Close main chamber valve

Depositing

Select what metal to deposit, selected by turning long red handle with holes at the front. There is a list of which metals are at which positions on the wall. There are 12 turns between adjacent positions for each metal.

• Crucible no. 1 is selected when the end of the thread is visible in the hole closest to the chamber.
• Crucible no. 5 is selected when the end of the thread is even with the end of the red handle.

1. Check logbook: if SiO₂ has been sputtered always start deposit 5 nm Ti.
2. Make sure that correct material (crucible) and deposition program are selected
3. Turn the sample to 0°.
4. Close sample shutter
5. Open Target shutter [4]
6. Turn on main e-gun power supply (check that cooling water is on) [1]
7. Turn on sweep control [2]
8. Turn on gun current [3]
9. Slowly increase the filament current (steps of 0.10 with 20 sec wait in between) [5]
10. After reaching 1.0 start increase continuously (but still slowly) until you get a stable rate.
11. Open sample shutter and at the same time press "zero" on the thickness monitor [6]
12. Close window shutter to avoid depositing material on view port
13. Change angle if desired
14. When desired thickness is achieved, close the Sample shutter
15. Turn down current
16. Turn off gun current
17. Turn off sweep control
18. Turn off main e-gun power supply (keep the cooling water on)

Unloading

1. Open window shutter
2. Close target shutter
3. Open sample shutter
4. Rotate sample holder to 270°
5. Open main chamber valve
6. Insert transfer rod
7. Remove sample holder
8. Close main chamber valve
9. Close pump valve
10. Turn off pump
11. Open nitrogen valves
12. When load lock opens, close nitrogen valves
13. Take out sample holder (Using fresh gloves)
14. Close load lock

    If you will use system again within a few minutes you can leave it like this.
    Otherwise go on:

15. Open pump valve
16. Start Pump
17. Open pump valve all the way

    If you or someone will use system later that day you can leave it like this.

    If no one is going to use the system (as far as you know) continue below.

18. When pump controller says "Normal operation" close pump valve
19. Turn of pump

Upper part of electronics rack showing:

Thickness monitor	Pressure meter for airlock and chamber
Turbo pump control for main chamber	Turbo pump control for airlock

Main chamber with metal selector.

Cooling water valves.

Lower part of rack, showing sweeper and e^--gun mains switch.

Close-up view showing the different valves and shutters

View from different angle of central parts of the deposition system.

Through viewport, empty sample holder.

Through viewport, sample rotated downwards, sputtering active.

Service, cleaning, 2005-10-14
E-gun, melted leads to filament, 2004-05-28
E-gun, arcing, 2004-02-11

Movie of loading (MPEG4, .mp4)
Courtesy of Daniel Öijerholm-Ström, taken with cell-phone camera.

Exchange of crucible, some images inside