Using sputter targets on Eurovac

The Eurovac depositioning system has two sputter targets and two power supplies for them. One is a DC supply and one is a 600 W RF supply with auto-matching network.
These power supplies can be switched between the sputter guns by disconnecting and connecting the relevant coaxial cables between supply and sputter gun. Check that the connector is properly attached.

A last update:
The first sputtering gun has a SiO2 target and the RF power supply is permanent connected to this.
The second sputtering gun has an unknown target right now.

Cesar 600 W RF power generator manual (pdf) for sputtering target. Limited access.
Cesar auto-matching unit manual (pdf) for sputtering target. Limited access.

  1. Follow instructions for loading
  2. Make sure the liner is in position 5 and the target shutter is closed
  3. Check and open the cooling water circuit for the sputter guns, one circuit and one flow indicator for both guns
  4. Make sure the correct power cord is connected to the correct sputter gun
  5. Connect the power cord to the matching network box
  6. Close Valve to the main chamber turbo pump to the mark (i.e. not completely closed)
  7. Open valve for desired gas slowly until valve is completely open
  8. Use needle valve to set desired striking pressure (4×10-3 mBar for DC and between 1.2-1.3×10-2 mBar for RF) check that the turbo pump power is not to high (< 120 W, if its still lower (about 25 W) you have probably closed the main valve completely)
  9. Open the shutter to the sputter gun.
  10. Turn on the desired power supply (DC or RF)
  11. Set the power to 40 watt and the network matching box to auto (RF)
  12. Increase the power a little until you strike a plasma, if needed
  13. If the plasma is not stable and the reflected power is higher the 1 W, switch the matching network to manual and tune CL and CT manually (RF).
  14. Decrease pressure to process pressure (4×10-3 mBar for both DC and RF)
  15. Slowly increase power until you reach desired process power
  16. Press zero on thickness monitor while opening sample shutter
  17. When desired thickness is reached close Sample shutter
  18. Decrease Power to 40 W
  19. Turn off Power supply
  20. Close valve for process gases (Caution: Don't use needle valve to close gas, this will damage the valve)
  21. Open valve to main chamber turbo
  22. Unplug the power cord to the auto matching-network
  23. Continue with unloading procedure
  24. Remember to sign in the logbook.
Note: Gold does not stick to the SiO2 so suggestion is that always run Ti before depositing Gold.
Eurovac has also Ag, Ge, Al and those sticking behaviour is not known to me.
Stefan Rosén, Daniel Öijerholm-Ström, Sebastian Andersson, Anders Liljeborg, Albanova Nanofabrication Facility.