Cleaning instructions for the Cryo RIE tool

According to recent discussions in cleanroom meetings and in order to avoid inconsistent etch rates, each user of Cryo RIE machine is supposed to run a cleaning recipe after they are done with the tool:

Before your RIE session:

If there is a fused silica carrier wafer, put it in the wafer container labeled post Cl2 cleaning recipe, which can be found next to the load lock.

After your RIE session:

  1. Remove your sample and carrier wafer

  2. Load the carrier wafer labeled post Cl2 cleaning recipe

  3. Run cleaning recipe:

    1. If you have been using Cl2-based etching, run the recipe named 1: postCl2 clean

    2. Otherwise, run the recipe 2: O2 Clean

    These recipes are the first ones in the recipes list

  4. Log the cleaning recipe in the log file on the computer

  5. You can leave the tool now, since the next users is supposed to unload the cleaning carrier wafer before their using the machine.
Amin Baghban, Thomas Lettner, Anders Liljeborg Nanostructure Physics, KTH.