Reactive Ion Etch (RIE)
with Inductive Coupled Plasma (ICP)
Operating Manual
Back side views and pump
Straight backside view
At the top is the cover for the back end of the turbo pump. Below are
the service connections starting with the process gases
(from left to right):
- Nitrogen
- Argon
- Oxygen
- Nitrogen for venting the chamber. It has an extra
pressure reduction valve mounted on the wall to the left.
This is for not to blowing the chips off the plate
during venting.
- Cooling water for table, in plus out.
- Nitrogen for turbo purge.
- Compressed air, blue tube, partly hidden by pump tube to rotary pump.
- Cooling water for turbo, in plus out.
Back side view from an angle
Here are the same service connections seen from another perspective.
Rotary pump and oil filter
Here is the rotary pump with its exhaust filter to the left.
To the right is the external oil filter with pump the get rid of various
compounds emmanating
from the chamber during etching.
Back to Introduction
Anders Liljeborg,
Nanostructure Physics, KTH.