Etching Tools

RIE Oxford Plasmalab 80+, Ar, O₂

RIE Oxford PlasmaPro 100 Cobra 300 ICP
  Process gases: O₂, Ar, CF₄, CHF₃, SF₆, C₄F₈, N₂

RIBE Oxford, installation during fall 2022

RIE Oxford Plasmalab 100, cryo,
  CF₄, CHF₃, SF₆, Cl₂, Ar, O₂,
  He-backside cooling.

Lecture about etching (limited access)